Mechanical Engineer, Annapurna Labs

Annapurna Labs (U.S.) Inc. Austin, TX

About the Job

Job summary
Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. We have data center locations in the U.S., Europe, Singapore, and Japan, and customers across all industries. We are seeking experienced Hardware Design Engineers to build the next generation of our cloud server infrastructure. Our success depends on our world-class server infrastructure; we’re handling massive scale and rapid integration of emergent technologies.

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience.

This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
You will be responsible for all phases of the Server design process, including Definition and owning Mechanical and Thermal Specifications, running analysis through prototyping and testing and controlling high Volume manufacturing during the product life cycle.


• B.Sc in Mechanical engineering
• Proficient with CAD tools to relay and communicate design concepts as well as review ODM designs
• Experience with thermal mechanical analysis tools
o ANSYS / equivalent analysis tool for structural / mechanical simulation
o Icepak or Flotherm analysis tool for thermal simulation of cards / chip packages
• Experience with thermal qualification validation
o Wind tunnel testing
o Heatsink design / qualification
o Rjc / Rca characterization + familiarity with JEDEC standards for package testing


• Master in Mechanical engineering
• Proficiency with PTC Creo CAD software
• Experience in first article analysis and tolerance analysis of multi-part complex assemblies
• Mechanical / Thermal design experience in network cards / FPGAs
o Chip / Package Mechanical Analysis / Design
o Board layout
o Card Stiffener Design
o Heatsink design (heatpipe, vapor chamber)
• Experience with shock and vibration qualification
o Drop, shock, vibration testing per MIL/ISTA standards
o Test fixture design
• Working experience with ODMs.

Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status. For individuals with disabilities who would like to request an accommodation, please visit